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Activities

Forum on Latest Acoustic Technology and Product Design - Hong Kong Electronic Industry Summit 2013

15-10-2013 Download

Dear Colleagues,

I write to cordially invite you to participate in the Forum on Latest Acoustic Technology and Product Design, Hong Kong Electronic Industry Summit 2013, which will be held in the morning of October 15, 2013 at Hong Kong Convention & Exhibition Centre. Attached please find the flyer of the event for your information.
 
The Forum will focus on the applications of the latest acoustic technology in various product designs and renowned experts will be present to share with participants their latest research advancement.
 
HKIOA being one of the supporting organizations for the event are given 15 free admission places to the Forum (not the Summit).  If you are interested to participate, please simply send an email to Dr. Randolph Leung at ( mmrleung@polyu.edu.hk ) with the following information.

[1] Full English name
[2] Email address
[3] Telephone number

Please note that the places are delivered on the first-come-first-served basis, and the deadline for submitting your application is at 12:00 pm on October 10, 2013. 
 
Thus, please enroll now and don’t miss such wonderful Forum.
 
Best Regards,
Mr. Wilson HO
Chairman of Activity Sub-committee